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TrendForce forecasts that AI server shipments in 2025 will grow by more than 20% YoY. As CSPs concentrate capital ...
TELEDYNE EV2 Engineering Models for 16GB radiation-tolerant DDR4 memory device maintains the compact form factor of the ...
BK11 Series multi-power hybrid FPC-to-board connector is equipped with two main power contacts supporting 4A per pin, four ...
Blackline Safety Corp., a manufacturer of safety wearable technologies, has announced an expansion of its quality assurance ...
SIA makes official statement on semiconductor development in U.S.
Leading North American distributor Sager Electronics, together with Advanced Energy, have added Impac, Mikron, Thyro, and ...
Claigan Environmental Inc. will present and compare the findings of restricted materials testing on consumer products from Canada and Poland.
If chips aren't exempt, it would increase the costs of designs, as semiconductors are the most expensive component in the ...
Report from Global Electronics Association reveals persistent cost pressures offset by solid demand conditions ...
PIXUS TECHNOLOGIES New design offering for carriers and specialty cards for AI computing, test & measurement, and other high ...
MaRS Discovery District and the Toyota Mobility Foundation (TMF) announced the 10 high-potential startups that will be ...
America must be a cost-competitive location to develop and produce chips, regarding U.S. President Donald Trump’s ...
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