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G and RF chip startups in EE Times’ Silicon 100 report address the biggest pain points in designing for 5G wireless devices ...
TDK’s EPCOS B3264xH series of film capacitors meets the demands of high-frequency applications in advanced power electronics ...
Nexperia introduces five 1-V ESD protection diodes to protect USB4 and Thunderbolt interfaces in a range of applications.
OKI Circuit Technology’s rigid-flex PCBs feature embedded copper “coins” that improve heat dissipation for space applications ...
Silicon Labs claims the first PSA Level 4 security certification with the Series 3 SiXG301 multi-protocol wireless SoC.
Efficient Computer’s Electron E1 general-purpose processor claims up to 100× higher energy efficiency than general-purpose ...
The automotive industry’s shift toward EVs, AVs, and connected cars calls for continual improvements in enabling technologies ...
TI’s BQ41Z90 and BQ41Z50 battery gauges with a predictive battery model enables precise battery monitoring for longer battery ...
KD, Leopard Imaging, and Corning collaborate on an IEEE 802.3cz–compliant multi-gigabit optical camera for automotive ...
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