TSMC management has indicated enormous AI opportunity for its foundry business, particularly for GPUs and ASICs. See why I ...

Ceva has recently unveiled the Ceva-Waves Links200 multi-protocol platform IP with support for Bluetooth LE High Data ...

IGMTLSV04A is a synchronous LVT / ULVT periphery high-density ternary content addressable memory (TCAM). It is developed with TSMC 12nm 0.8V/1.8V CMOS LOGIC FinFET Compact Process. Different ...

The Multi Phase DLL is designed for high-speed interface applications. The DLL generates precise multi-phase clocks directly from the reference clock. It delivers optimal jitter performance over a ...

Why it matters: Management provided upbeat guidance for 2025 and beyond. TSMC expects revenue to grow in the mid-20s in 2025 and average 20% over the next few years. This is higher than the previous ...

New connectivity standard brings performance improvements and a bunch of new features, but it may take years before they are ...

CES 2025 – Striking the Perfect Balance Between High Performance and Power Efficiency in the Computational Era The SM2508 capitalizes on TSMC's 6nm ... by 50% compared to 12nm solutions.

This is an entry-level SoC manufactured by TSMC using a 12nm FinFET process, compared to the latest SoCs from Samsung and MediaTek, which use 6nm or even 4nm fabrication. It fits the phase that ...

Nvidia has revealed Maxwell, Pascal, and Volta architectures are considered feature-complete and will be frozen in an upcoming CUDA release.