Alphawave Semi, a developer of high-speed connectivity and compute silicon for technology infrastructure, has taped out one ...

GENESIS Project to develop more sustainable processes and technologies for the semiconductor-manufacturing industry.

Softbank and Intel are developing a new large-capacity memory that will reduce power consumption compared to HBM.

GlobalFoundries to invest $16 billion to expand its semiconductor manufacturing and advanced packaging capabilities.

Even after three years of mass production, Samsung is said to be struggling to raise 3nm yields above 50 per cent.

Hirose has launched a shielded USB Type-C connector that complies with USCAR-2 and USCAR-30 standards. The AU1 Series ...

Sarcina Technology has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO).

Mixed Signal Devices has announced its next-generation clock and timing portfolio. This new lineup introduces ...

Broadcom has started shipping the Tomahawk 6 switch series, delivering the world’s first 102.4 Terabits/sec of switching ...

Blighter, a developer of electronic-scanning ground movement radars, has unveiled the B422LR border surveillance system.

Infineon announces collaboration with Typhoon HIL, a provider of Hardware-in-the-Loop (HIL) simulation solutions.

Combining optical and microwave signal processing on a single silicon chip the research groups have integrated high-speed ...