Taara already uses beams of light to extend high-speed internet to places where traditional infrastructure is difficult to ...
In a recent ribbon-cutting ceremony today, Lam Research Corp. commemorated the opening of its new office in Boise, Idaho, ...
Sarcina Technology, a specialist in semiconductor and photonic packaging, has won the “Packaging: Hardware” category at the 2026 Chiplet Summit Best of Show Awards for its advanced AI package design ...
Presto Engineering has appointed Charles Hosono as Chief Executive Officer. He succeeds Cédric Mayor, who is stepping down to pursue new projects after contributing to the company's development for ...
Researchers at CEA-Leti and CEA-IRIG-SyMMES have validated a chip-scale electron paramagnetic resonance (EPR) spectrometer that achieves unprecedented scan speed, spectral span, and sensitivity from a ...
A team of researchers from Europe and South Korea is using photonics to cut the energy cost of AI and strengthen cybersecurity for future digital services.
At IEEE ISSCC 2026, imec introduces a 7-bit, 175GS/s wireline ADC implemented in 5nm FinFET technology, combining a record-small footprint (250 x 250µm²) and low conversion energy (2.2 pJ per sample).
Keysight Technologies has introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity of designing 3D ...
Rather than forcing all data to reside near compute cores to minimize electrical routing costs, dynamically routed optical links allow architects to treat memory and compute resources across the ...
Multi‑billion-dollar collaboration strengthens supply chain resiliency and supports growing demand for chips powering smart vehicles and next-generation industrial systems.
Imec has inaugurated a 2,000m² cleanroom expansion at its Leuven headquarters, marking a pivotal milestone in the deployment ...
Experts from Swansea University’s Computer Science Department are playing a key role in an international initiative tackling ...