Dublin, March 29, 2021 (GLOBE NEWSWIRE) -- The "Global Mixed Signal IC Market By Type (Mixed Signal SoC, Microcontroller and Data Converter), By End User (Consumer Electronics, Medical & Healthcare, ...
New York, Jan. 13, 2022 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Display Driver IC Market Research Report by Display Technology, by IC Package Type, by Application, by ...
PS8402A First to Support Top HDMI 1.4 Data Rate of 3.0Gbps SAN JOSE, Calif.--(BUSINESS WIRE)-- Parade Technologies Ltd. (Taiwan OTC: 4966.TWO), a leading video display and interface IC supplier, today ...
HSIN-CHU, Taiwan--(BUSINESS WIRE)--Etron Technology, Inc. (Taiwan GTSM: 5351) unveils its latest USB Type-C Switch IC: the EJ179. The EJ179 can route USB 3.1 / USB 3.0 / USB 2.0 signal pairs, support ...
A new technical paper titled “Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects” was published by researchers at Siemens EDA, D2S, and Univ.
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