Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This ...

This new technical paper titled “End-to-end deep learning framework for printed circuit board manufacturing defect classification” is from researchers at École de technologie supérieure (ÉTS) in ...

In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...

What methods can be applied to verify PCB functionality and safety? Which are suitable for mass production and for prototypes? What parameters are checked in each test? How to check a PCB without ...

IPC standards for better PCB manufacturing and assembly. Advantages of IPC standards. The Institute for Printed Circuits (IPC) is as known as the Association Connecting Electronics Industry. It’s a ...