Samsung Electro-Mechanics is said to have raised prices for flip chip ball grid array (FC-BGA), a high value-added semiconductor substrate. FC-BGA is a core substrate used in artificial intelligence ...
The Chosun Ilbo on MSN
Samsung Electro-Mechanics invests 1.8T won in Vietnam for FC-BGA expansion
Samsung Electro-Mechanics is making an investment of 1.8 trillion Korean won in Vietnam to expand production capacity for ...
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