A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
Oh it's the magic circle. Can't wait to be dazzled with a few tricks. Er…let's stick to some simple stuff for now. How about some transformations? If a shape is transformed, its appearance is changed.
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